Custom Electronic Injection Molding Heat Dissipation Injection Plastic Parts Lightweight
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Custom Electronic Injection Molding
,Heat Dissipation Injection Plastic Parts
,Injection Plastic Parts Lightweight
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ProductElectronic Injection Molding
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Design SoftwareUG,CAD,PROE,etc,AutoCAD
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CavityMulti Cavity,Single/multi,Single Cavity\ Multiple Cavity,Single & Multi,Family Mold
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Surface TreatmentPolish. Etched. Texture,Polishing,etc,screen Printing,Plating
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RunnerHot Runner\ Cold Runner,Cool/Hot
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Mould MaterialP20/718/738/NAK80/S136,2738,SKH-9,XW-42,8407
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MaterialABS,PP,PC,POM,Steel
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ColorPantone Or Ral Colors,Natural Or As Required,Yellow,As Customers' Requirements,As Customers' Choice
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SizeAccording To Your Drawing,Customers Request,Customized
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Tolerance+/-0.02mm,0.001mm
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Place of OriginDongguan, China
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Brand NameMID MOULD
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CertificationISO9001, ROHS, UL (if applicable)
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Minimum Order Quantity500–1000 pcs (adjustable depending on project)
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PriceUSD $0.1–$3.5 per piece (depends on material, part size, and volume)
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Packaging DetailsPlastic bag + carton box, or customized packaging
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Delivery Time7–20 working days (faster for small batch)
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Payment Terms50% deposit + balance before shipment
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Supply AbilityUp to 50,000 pcs per day depending on mold cavitation and cycle time
Custom Electronic Injection Molding Heat Dissipation Injection Plastic Parts Lightweight
General Electronic Heat Dissipation Structural Components
Electronic heat dissipation structural components are manufactured using engineering plastics such as PC+ABS, PA66+GF, and PBT through injection molding combined with optimized heat dissipation design. They are commonly used for heat dissipation, support, and protection within electronic devices.
- Material Preparation and Drying
- Injection Molding of Heat Sinks or Air Guides
- Surface Texture Treatment
- Functional Testing (Heat Dissipation Efficiency, Assembly Accuracy)
- Finished Product Packaging
| Parameter | Value Range/Description |
|---|---|
| Material | PC+ABS, PA66+GF, PBT |
| Accuracy | ±0.03 mm |
| Mold Life | 600,000–1,000,000 Cycles |
| Wall Thickness | 0.8–3 mm |
| Temperature Resistance | -20°C to 120°C |
| Features | Optimized heat dissipation, heat resistance, lightweight |
| Applications | Heat sink brackets, air guides |
| Molding Cycle | 12–25 seconds |
| Surface Treatment | Texture, Painting |
| Dimensions | Customizable |
Suitable for fan air guides, electronic cooling modules, and internal ventilation structures. Provides stable heat dissipation support.
- High-precision molding ensures airflow guidance
- Excellent heat resistance
- Lightweight, reduces equipment weight
- High assembly accuracy, suitable for complex structures
- Mass production possible
We can customize the heat dissipation structure shape, air guide design, snap-on connectors, logo, and more to meet the cooling needs of different electronic devices.
Our services cover all industries and reach all parts of the world.
